Pb-free compatible BUMP formation reflow SMT Reflow
We can accommodate from BGA packages to 12” wafers!
□ The BGA package is compact yet features a 6-zone specification. □ Achieves an oxygen concentration in the furnace of below 100 ppm. □ In-plane temperature distribution: ±2℃. □ Built-in catalytic device effective for purification within the furnace. □ Wafer transport uses a uniquely developed walking beam method.
- 企業：大日商事
- 価格：Other
